Memory device architecture coupled to a system-on-chip

ABSTRACT

The present disclosure relates to an apparatus comprising a non-volatile memory architecture configured to be coupled to a System-on-Chip (SoC) device. The non-volatile memory device coupled to the SoC having a structurally independent structure linked to the SoC includes a plurality of sub arrays forming a matrix of memory cells with associated decoding and sensing circuitry, sense amplifiers coupled to a corresponding sub array, a data buffer comprising a plurality of JTAG cells coupled to outputs of the sense amplifiers; and a scan-chain connecting together the JTAG cells of the data buffer.

PRIORITY INFORMATION

This application is a Continuation of U.S. application Ser. No.16/625,318, filed on Dec. 20, 2019, which is a National StageApplication under 35 U.S.C. § 371 of International Application NumberPCT/IB2019/000465, filed on May 31, 2019, the contents of which areincorporated herein by reference.

DESCRIPTION

The present invention relates to memory devices and more particularly toan architecture of flash memory device that is coupled to aSystem-on-Chip (SoC). More specifically, the invention relates to ascalable and high throughput architecture for a flash array of memorycells.

BACKGROUND

A flash memory is a type of non-volatile memory that retains stored datawithout a periodic refresh thanks to the electricity. An importantfeature of a flash memory is the very fast access time and the fact thatit can be erased in blocks instead of one byte at a time. Each erasableblock of memory comprises a plurality of non-volatile memory cellsarranged in a matrix of rows and columns. Each cell is coupled to anaccess line and/or a data line. The cells are read, programmed anderased by manipulating the voltages on the access and data lines.

Non-volatile memories retain their contents when power is switched off,making them good choices for storing information that must be retrievedafter a system power-cycle. However, a non-volatile memory is typicallymuch slower to read and write to than a volatile memory, and often hasmore complex writing and erasing procedures; moreover, relatively highvoltages must be applied to the array of cells. The read phase is oftendone using a Finite State Machine (FSM) that regulates all the timingsand internal voltages.

Non-volatile Flash memories are today one of the fundamental buildingblocks in modern electronic systems, including the SoC devices forautomotive applications, in particular for RealTime Operating Systems(RTOS). Their performance in terms of speed, consumption, alterability,nonvolatility and the increasing importance of system reconfigurabilityhave pushed up to now for flash memory integration in System-on-Chipdevices. However, embedded memories realized with the SoC technologiesare becoming larger and larger components in a SoC and it is noteffective to increase their size to more than 128 Mbit for instance.

Flash integration introduces many issues both at system and atcircuit/technology levels that need a careful design. From the systempoint of view, several aspects are involved in the choice of the flashmemory type to be integrated in the SoC device; the most important ones,depending on the specific applications and requirements, are the yieldand then their cost, power consumption, reliability and performancerequirements.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic and perspective view of a System-on-Chip deviceaccording to the prior art and including an embedded memory portion;

FIG. 2 is a schematic and perspective view of a System-on-Chip deviceaccording to the present disclosure and including a memory componentreplacing the embedded memory portion of the prior art devices;

FIG. 3 is a schematic view of the memory component according to thepresent disclosure;

FIG. 4 is a schematic view of a particular of the memory portion shownin FIG. 3 ;

FIG. 4A is another schematic view of a further particular of the memoryportion shown in FIG. 4 ;

FIG. 5 is a schematic view of JTAG cell that has been modified accordingto the present disclosure;

FIG. 6 is a schematic view of a group of address registers for a memoryword in the memory portion of the present disclosure;

FIGS. 7 and 8 are schematic views of a relationship between address anddata registers in the memory portion of the present disclosure.

DETAILED DESCRIPTION

On-chip memory is the simplest type of memory for use in many kinds ofcontrollers an FPGA-based embedded system. The memory is implemented inthe FPGA itself; consequently, no external connections are necessary onthe circuit board.

A field-programmable gate array (FPGA) is an integrated circuit designedto be configured by a customer or a designer after manufacturing.

FPGAs contain an array of programmable logic blocks, and a hierarchy ofreconfigurable interconnects that allow the blocks to be wired together,like many logic gates that can be inter-wired in differentconfigurations. Logic blocks can be configured to perform complexcombinational functions, or merely simple logic gates like AND and XOR,for example.

In most FPGAs, logic blocks also include memory elements, which may besimple flip-flops or more complete blocks of memory. Many FPGAs can bereprogrammed to implement different logic functions, allowing flexiblereconfigurable computing as performed in computer software.

Most modern embedded systems use some type of flash memory devices fornon-volatile storage. Embedded systems use memories for a range oftasks, such as the storage of software code and lookup tables (LUTs) forhardware accelerators.

With reference to the figures, apparatuses and methods involving anon-volatile memory device or component and a host device for such amemory device will be disclosed herein.

Descriptions of well-known components and processing techniques areomitted so as to not unnecessarily obscure the embodiments herein. Theexamples used herein are intended merely to facilitate an understandingof ways in which the embodiments herein may be practised and to furtherenable those of skill in the art to practice the embodiments herein.Accordingly, the examples should not be construed as limiting the scopeof the embodiments herein.

A flash memory is a type of non-volatile memory that retains stored datawithout a periodic refresh thanks to the electricity. Flash memories canbe erased in blocks instead of one byte at a time. Each erasable blockof memory comprises a plurality of non-volatile memory cells arranged ina matrix of rows and columns. Each cell is coupled to an access lineand/or a data line. The cells are programmed and erased by manipulatingthe voltages on the access and data lines.

Currently, the technology of the complex semiconductor structures knownas System-on-Chips provides the integration of at least an embeddednon-volatile memory, for instance up to 128 Mbit.

FIG. 1 shows an example of a known solution of a complex System-on-Chip(SoC) structure 100 including a large circuit portion occupied by aconventional embedded non-volatile memory portion 110.

This embedded non-volatile memory portion 110 includes an array of Flashmemory cells indicated in FIG. 1 as eFlash Array.

In order to read the memory cells of the array, it is provided adedicated circuit portion 130 including an optimized Read Finite StateMachine that is used to ensure high read performance, such as branchprediction, fetch/pre-fetch, interrupt management, error correction andso on.

In order to write and erase the memory cells of the Array, it isprovided a dedicated logic circuit portion 140 including a simplifiedReduced Instruction Set Computer (RISC) controller or a Modify FiniteState Machine which is the logic circuit for handling the programmingand erasing algorithms.

While being advantageous under many aspects, the System-on-Chipsincluding large memory arrays may suffer for many drawbacks since thememory portion is realized with a process not specifically designed formemories and possible defects of the memory array may compromise thelife or the functioning of the whole SoC structure. Moreover, if a SoChas already a flash array as an embedded memory it would be desirable tohave also an extended non-volatile memory as a sort of far memory.

According to embodiments of the present disclosure, to improve theperformances of the whole SoC structure the old memory portion 110 hasbeen realized as an independent memory device with a technologyspecifically dedicated to the manufacturing of flash memory devices.This new memory component is associated and linked to the SoC structurepartially overlapping such a structure while the correspondingsemiconductor area of the SoC structure has been used for other logiccircuits and for providing support for the overlapping structurallyindependent memory portion.

Therefore, an aim of the present disclosure is that of suggesting anon-volatile memory structure that can improve the access time. In anycase, the System-on-Chip and the associated memory device are realizedon a respective die obtained by a different lithography process.

As shown in FIG. 2 , according to the present disclosure, we mayconsider that the memory portion (i.e. the old reference number 110 ofFIG. 1 ) has been removed from the SoC structure thus allowing to usethe corresponding semiconductor area for other logic circuits and forproviding support for a structurally independent memory component 210partially overlapping a SoC structure 200.

The memory component 210 is structured as a stand-alone device realizedin a single die with a technology specifically dedicated to themanufacturing of flash memory devices. The memory component 210 is anindependent structure but it is strictly associated to the host deviceor to the SoC structure. More particularly, the memory component 210 isassociated and linked to the SoC structure partially overlapping such astructure while the corresponding semiconductor area of the SoCstructure has been used for other logic circuits and for providingsupport for the partially overlapping structurally independent memorydevice 210 for instance through a plurality of pillars 230 or othersimilar alternative connections such as ball on grid or with atechnology similar to the Flip-Chip technology.

In one embodiment of the present disclosure the disposition of the padsof the memory component 210 has been realized on a surface of the memorycomponent at the periphery of the structurally independent Flash device.More specifically, the plurality of pads has been realized around thearray so that when the memory component 210 is reversed and its pads arefaced to corresponding pads of the SoC structure 200. The semiconductorarea that in known System-on-Chip devices that in known solution wasoccupied by an embedded non-volatile memory portion is now dedicated tothe housing of the interconnecting pads corresponding to the pads of thememory component 210.

More particularly, adopting a Pads Over Logic technology, the pads arebuilt on top of the logic used to communicate with the independent andoverlapping memory component 210, similarly to the 3DNand implementingthe circuit under the array (CUA technology).

In order to mount the chip to external circuitry (e.g., a circuit boardor another chip or wafer), the chip is flipped over so that its top sidefaces down and aligned pads-to-pads so that its pads are aligned withmatching pads on the external circuit. Then the solder is reflowed tocomplete the interconnections.

This technology is different from wire bonding, in which the chip ismounted upright and wires are used to interconnect the chip pads toexternal circuitry.

The final configuration will be a face-to-face interconnection SoC/FlashArray with the sense amplifiers will be connected to the SoC in a DirectMemory Access configuration.

At the end, the memory component 210 is manufactured according to theuser's needs in a range of values that may vary according to theavailable technology, for instance from at least 128 Mbit to 512 Mbit oreven more without any limitation for the applicant's rights. Morespecifically, the proposed external architecture allows to overpass thelimit of the current eFlash (i.e. embedded flash technology) allowingthe integration of bigger memory, as it can be 512 Mbit and/or 1 Gbitand/or more depending on the memory technology and technology node.

The result of this solution is the new SoC structure of FIG. 2 ,strictly associated with the new structurally independent memorycomponent 210 that is coupled to the SoC structure 200, for instancethrough a plurality of coupling elements 230, such as pillars, as wellas through ball-on-grid, flip-chip technology, face-to-faceinterconnection (coils) and the like. In one embodiment, the couplingelements are pillars 230, which are arranged in the semiconductor area220 previously dedicated to the embedded memory portion 110 of FIG. 1 .

In one embodiment of the present disclosure, the memory component 210for the SoC structure 200 includes at least a memory portion and a logiccircuit portion for interacting with the memory portion and with the SoCstructure 200, wherein the memory component 210 is a structurallyindependent semiconductor device coupled to and partially overlappingthe System-on-Chip structure 210. A logic circuit 240 is integrated inthe SoC structure 200 to cooperate with the logic circuit portion of thememory component 210.

The coupling between the SoC structure 200 and the memory component 210is made by interconnecting a plurality of respective pads or pinterminals that are faced one toward the other in a circuit layout thatkeeps the alignment of the pads even if the size of the memory component210 is modified.

In one embodiment of the present disclosure, the arrangement of the padsof the memory component 210 has been realized on a surface of the memorycomponent 210. More specifically, the pads are arranged over the arrayso that, when the memory component 210 is reversed, its pads are facedto corresponding pads of the SoC structure 200. The semiconductor area220 that in known System-on-Chip structures 100 was occupied by theembedded non-volatile memory portion is dedicated to the housing of theinterconnecting pads corresponding to the pads of the memory component210.

Even a memory component of a larger size may be supported andinterconnected with the pads of the SoC structure 200, keeping theposition and dislocation of its interconnecting pads.

In the contest of the present disclosure, the SoC structure 200 has itstop side linked with the reversed side of the memory component 210, thepads of the SoC structure 200 being aligned with matching pads of thereversed memory component.

As an alternative, the structurally independent memory component 210 maybe coupled to the SoC structure 200 in a face-to-face manner. If aface-to-face coupling is adopted, a stack of memory components of thesame size could be overlapped realizing a stack structure, wherein eachindependent component is addressed by the logic circuitry of the SoCstructure 200 though a corresponding identification address.

The semiconductor area 220 previously occupied by the embedded memoryportion 110 is now used to implement additional functionalities and toprepare the semiconductor device for a Logic Over Pads technology. Theexpression “Logic Over Pads” means providing logic circuitry overlappingsome connection pads located internally to a first or base layerrepresented by a complete semiconductor product, i.e. the SoC structure200.

The memory component 210 thus represents an upper layer coupled andinterconnected to the base SoC structure 200. The memory component 210partially overlaps the SoC structure surface covering at least thesemiconductor area 220 previously occupied by the embedded memoryportion 110. However, the memory component 210 has a greater capacitycan cover a larger semiconductor area than the semiconductor area 220.In this respect, the size of the overlapping memory component 210 islarger than size of the overlapped semiconductor area 220 dedicated tothe interconnections with such covering memory component 210. In otherwords, the area of the overlapping memory component 210 is larger thanthe semiconductor area 220 of the SoC structure 200 dedicated to theinterconnecting pads for the memory component 210.

Moreover, for a better functioning of the SoC structure 200, even thelogic circuit portion 140 of FIG. 1 (which in the System-on-Chipstructure 100 of FIG. 1 included the Modify Finite State Machine orRISC) can be removed and reorganized in association with the memorycomponent 210. For supporting the write and erase phases performed onthe larger memory component 210, a Modify Finite State Machine or RISC240 has migrated into the memory component 210.

As previously indicated, the memory component 210 includes the logiccircuit portion for interacting with the memory portion and with the SoCstructure 200.

The separation and optimization of the logic circuit portion furtherallows to enhance the functionality of the whole SoC structure 200, thusobtaining an independent semiconductor memory component 210 coupled tothe SoC structure 200.

This independent semiconductor memory component 210 therefore includesat least the memory portion (preferably a non-volatile memory portion)and the associated modify finite state machine 240, both incorporatedinto a semiconductor product that is coupled to the SoC structure 200.In this case, the logic embedded in the SoC is the read logic: fetch ofthe data, correction of the data, elaboration and execution.

As will appear in the following of the present disclosure, a DMAcapability is provided to the memory component 210 with an interfacelogic JTAG TAP using modified JTAG cells as well as a flexible TDI,secure access, address buffers and other features for handling thecommunication with the SoC structure 200.

In other words, both the non-volatile memory portion and the associatedlogic circuit portion are integrated in the independent semiconductormemory component 210 that is coupled and connected to the SoC structure200.

Now, with more specific reference to the example of FIG. 3 , the mainstructure of the memory component 310 according to an embodiment of thepresent disclosure will be disclosed, wherein the reference 310 of FIG.3 corresponds to the reference 210 of FIG. 2 .

The memory component 310 includes at least: an I/O circuit, amicro-sequencer, an array of memory cells 320, an array peripheral, acharge pump architecture, address decoders, sense amplifiers andcorresponding latches, a service logic to connect all the parts of thememory, and a command user interface, for instance a CUI block.

The array of memory cells 320 includes non-volatile Flash memory cells.In ne embodiment of the present disclosure, the memory component 310implements a Direct Memory Access type of memory to replace the embeddedmemory array of known SoC devices.

Moreover, a JTAG interface 350 is adopted for the test of the memorycomponent 310, allowing the re-use of the testing tooling. Therefore,the memory component 310 also comprises a JTAG logic 350. This JTAGinterface 350 will be disclosed later in more details with reference toFIG. 6 .

In more details, each memory array includes at least a JTAG interface350 receiving as inputs standard JTAG signals: TMS, TCK, TDI as well asdata from a memory page, as shown in FIG. 6 . According to embodimentsof the present disclosure, an extended TDI is used as flexible TDI. Theflexibility is due to the fact that the number of parallel bits workingas TDI are depending from the selected registers, i.e. K (four, in theexample) lines for the instruction register, M lines for the addressregister, N lines for the data register, etc. while TDI comes from theJTAG protocol that uses TDI as name on the signal used to fill theregisters.

This JTAG interface 350 produce as output data, addresses and controlsignals that are transferred to a memory address decoder 340 and also tothe internal flash controller 4300 to perform modify, testing,verification operations.

The activity of the decoder 340 is allowed by charge pumps 3430structured to keep secret the voltages and timings to manage the array.The decoding phase drives the data lines while the charge pumps providethe high voltage routed by the address decoder in the selected datalines.

This decoder 340 addresses the selected memory block. The addressdecoder is connected to the array to select the proper data lines, i.e.row and column for each super-page. the read, modify and any otheroperations are using the address decoder to properly address bytes inthe memory array.

A memory block is connected to the sense amplifiers and the senseamplifiers of the read interface 360 are connected to the SoC structure200 using the modified JTAG cells. The communication channel between theflash array blocks and the SoC structure 200 is represented by a controland status bus.

The output of the read interface 360 is represented by an extended pageincluding the combined string of data cells+address cells+ECC cells. Thewrite operation also drives the three components (data cells+addresscells+ECC cells) of the extended page; the ECC and the address cellsserves as a safety mechanism to ensure the low probability to makemistakes.

The total amount of Bits would involve in the example disclosed herewithN+M+R Bits, for instance one-hundred-sixty-eight pads per channel in theimplementation disclosed herewith.

The memory array 320 of the memory component 310 is built as acollection of subarrays. The scan chains can be connected to form aunique shift register to proper test the interconnections.

The advantage of this architecture is that it is very scalable, whereinexpanding and/or reducing the density of the final device translatesonly in mirroring a sub-array and providing the correspondinginterconnections in a very scalable manner. The memory can be expandedalso increasing the memory size per sub array, without enlarging thenumber of channels for the SoC.

The Direct Memory Access allows to reduce the final latency that the SoCcan experience when reading the data.

Coming now to a closer look to the internal structure of the memorycomponent 210 (or 310) it should be noted that the architecture of thememory array 320 is built as a collection of sub arrays 420, as shownschematically in FIG. 4 , wherein the reference 320 of FIG. 3corresponds to the reference 420 of FIG. 4 .

Each sub array 420 is independently addressable inside the memory device310. Each sub-array 420 contains multiple memory blocks 460 (as depictedin FIG. 4A).

In this manner, having smaller sectors if compared to known solutionsthe access time is significantly reduced and the whole throughput of thememory component is improved. The reduction of the initial latency timeis at block level because the row and column lines, the read pathassociated latency and the external communication have been optimized.The initial latency is the time needed to have the first valid dataafter the issuing of the address.

In the embodiments disclosed herewith the memory array is structuredwith a number of sub-arrays 420 corresponding to the number of cores ofthe associated SoC structure 200 and, therefore to the number ofcorresponding communication channels. For instance, at least four memorysub arrays 420 one for each communication channel with a correspondingcore of the SoC structure 200 are provided.

The host device or the System-on-Chip (SoC) structure 200 normallyincludes more than one core and each core is coupled to a correspondingbus or channel for receiving and transferring data to the memorycomponent 210 or 310. We will make a generic reference to a number of Kbuses for N data Bits.

Therefore, in the present implementation each sub-array 420 has accessto a corresponding channel to communicate with a corresponding core ofthe SoC structure 200. The outcome of the memory blocks is drivendirectly to the SoC without using high power output buffers andoptimizing the path.

The advantage of this architecture is that it is very scalable, whereinexpanding and/or reducing the density of the final device translatesonly in mirroring a sub-array and generating the connection orincreasing the number of blocks of each subarray, that is the availabledensity per core.

In embodiments of the present disclosure each independently addressablelocation of the blocks of each memory sub array 420 addresses anextended page 450 that will be also defined hereinafter with the termsuper-page intending a double extended page.

As non-limiting example, this extended page 450 comprises a stringincluding a first group of at least N Bits, for instanceone-hundred-twenty-eight (128) Bit for the I/O data exchange with theSoC structure 200 plus at least a second group of M Bits, for instancetwenty-four (24) address Bit and a final or third group of at least RBits, for instance sixteen (16) ECC Bit. The M address Bit (in theexample the twenty-four address Bits) are sufficient to address up to 2GigaBit of available memory space.

According to the present disclosure, the outputs of the sense amplifiersSA prepare a double extended page at a time, i.e. a super-page 450comprising a number of Bits given by the double combination of theabove-mentioned three groups of data bits, address bits and ECC bits,according to the size of the memory array.

In the specific but non-limiting example disclosed herewith eachextended page 450 includes at least 168 Bit obtained by the combinationof the above three groups of N+M+R=128+24+16 data, address and ECC Bitand each super-page is formed by a couple of extended pages, i.e. agroup of 168×2 Bits.

Just to give a non-limiting numeric example, each row of a memory block460 includes sixteen extended pages. Therefore, the resulting rowincludes 2688 Bit coming out from the combination of sixteen extendedpages independently addressable and each including 168 Bit or, saiddifferently, the combination of eight super-pages.

In embodiments of the present disclosure the output of a genericsub-array 420 is formed combining the following sequence: N data cellsplus M address cells plus R ECC cells. In this non-limiting example thetotal amount of Bits would involve 168 pads per channel, as shown in theexample FIG. 6 .

The combined string of data cells+address cells+ECC cells allowsimplementing the safety coverage of the bus according to the standardrequirements, because the ECC covers the whole bus communication (datacells+address cells), while the presence of the address cells providethe confidence that the data is coming exactly from the addressedlocation of the controller.

The sense amplifiers SA of each sub array 420 are connected with ascan-chain of modified JTAG cells 480, connecting together all theoutput of one sub-array 420, as disclosed hereinafter.

Thanks to the memory architecture of the present disclosure it ispossible to pass from a parallel mode for retrieving data and addressesfrom the memory sub arrays 420 to a serial mode for checking theinterconnections between the memory component 210 and the associated SoCstructure 200. Moreover, the SoC structure 200 is entitled to read once‘1’ and once ‘0’ to perform tests and can also analyze the memoryoutcome, scanning out the data using the scan-chain.

It should be further noted that each subarray 420 includes addressregisters connected to data buffer registers, similarly to anarchitecture used in a DRAM memory device, i.e. DDRX type of DRAMs.

In the following paragraphs of the present disclosure it will beapparent that the outputs of the sense amplifiers SA per sub array 420are latched by an internal circuit, so to allow to the sense amplifiersto execute a further internal read operation to prepare the secondnibble or group of 168 Bits. This second nibble is transferred to theoutput of the flash array 320, using an additional enabling signal (i.e.an internal clock signal or an ADV signal; ADV=Address Data Valid. inour case the signal is load_data[1:0], depending on the addressed flipflop) that transfers the content read at sense amplifier level to thehost device or SoC structure 200.

In other words, the internal sense amplifiers prepare two extended pages450 and while the first page is ready to be shifted (or also shiftedout), internally it is performed a reading phase of the second pageassociated with the same address. This allows to prepare from five toeight double word (in the present example), that are typical in the RTOSapplication. In any case, the disclosed structure can be expanded toallow multi-page read while shifting out the already read page.

The sense amplifiers SA are connected directly to a modified JTAG cells480, that will be later disclosed in greater details, so to integrate aJTAG structure and the sense amplifiers in a single circuit portion.This allows reducing as much as possible the delay in propagating theoutput of the memory array to the SoC.

Just to report a numeric example based on the embodiment disclosedherewith, we may remark that each address in the address buffers islinked to a data buffer, containing for instance N data Bits (i.e. 128Bits). However, the SoC can need up to 2*N Bits (i.e. 256 Bits, withoutthe address Bits and the ECC) at a time, so the data buffers will beduplicated so to be able to shift, assuming to use the address 0 of thesub array 0:

-   First pass of the first group of N Bits: Data 0_0_H [127:0]-   Second pass of the second group of N Bits: Data 0_0_L [127:0]

The above indications are for a standard read used for instance forsafety purpose and data integrity/correction.

In one embodiment the address buffers are realized making use ofmodified JTAG cells 480 as we will see hereinafter.

According to one embodiment of the present disclosure it is disclosed aFlash memory device architecture coupled to a System-on-Chip including amatrix of memory cells with associated decoding and sensing circuitryand having a structurally independent structure coupled and linked tothe System-on-Chip and comprising:

-   -   a plurality of sub arrays forming said matrix of memory cells;    -   sense amplifiers coupled to a corresponding sub array;    -   a data buffer including a plurality of JTAG cells coupled to the        outputs of the sense amplifiers;    -   a scan-chain connecting together the JTAG cells of said data        buffer.

As previously said, the sense amplifiers SA of each sub array 420 areconnected with a scan-chain 430 (shown with a dotted line in FIG. 4 ),connecting together all the output of one sub-array 420, as shown inFIG. 4 . Moreover, the sub array scan-chains 430 can be connected toform a unique chain for quickly checking the integrity of the padsinterconnections.

Making reference to FIG. 4 we may consider the scan-chain 430 as formedby the interconnections of each JTAG Cell 480:

PIN is coupled to the output of a sense amplifier; POUT is coupled tothe corresponding Data I/O of the System-on-Chip; SIN is the serial INinput connected to the SOUT of the previous sense amplifier while SOUTis the serial output connected to the SIN of the next sense amplifier.

This scan-chain 430 formed by the interconnected cells 480, using theserial input and output, has some advantages:

-   -   allow testing the successful interconnection between the SoC        structure 10 and the memory component 1;    -   allow implementing a digital test of the sense amplifiers,    -   allow working as second level of latches.

Moreover, since the cell can work as program load to store the datainside the matrix of memory cells, usually the program load are bufferused to drive the program operation inside the array using it ascomparison register.

We will see later in the present disclosure that when the first 128 Bitsare ready to be transferred to the parallel output POUT of the senseamplifier, there is an internal latch coupled to the sense amplifierthat can trigger the read data of the subsequent section of theremaining 128 Bits.

But let's proceed in good order.

The System-on-Chip (SoC) structure 200 normally includes more than onecore (not shown in the drawings) and each core is coupled to acorresponding bus or channel for receiving and transferring data to thememory component 210. Each sub-array 420 has access to a correspondingchannel to communicate with a corresponding core of the SoC.

Each subarray scan-chain 430 can be serially connected to form a uniquechain with the other sub-array and/or it can be treated as a separatescan-chain register.

Each sense amplifier SA of the sub-array 420 is couple to a JTAG cell480.

In some embodiment of the present disclosure the output of a sub-array420 is formed combining the following sequence: data cells plus addresscells plus ECC cells. In particular, a sense amplifier SA is configuredto provide and output combining data cells, address cells and ECC cells.The total amount of Bits would involve 168 pads per channel in theimplementation disclosed herewith, the memory device architecture beingthus configured to transmit a super-page through a channel comprising atleast 168 pads. In other words, a sub-array of the plurality ofindependently addressable sub-arrays is thus organized in enlarged pagescomprising data, address and ECC bits.

The combined string of data cells+address cells+ECC cells allows toimplement the whole safety coverage of the bus according to the standardrequirements of the rule ISO26262, because the ECC covers the whole buscommunication (data cells+address cells), while the presence of theaddress cells provides the confidence that the data is coming exactlyfrom the addressed location of the controller, i.e. if ADD==ADD0.

The memory device 210 can store in a non-volatile manner the initialaddress that must be read at the boot of the system, that is to say: thewhole System-on-Chip or SoC structure with the associated memorycomponent 210.

It must also be remarked that a System on Chip of the present disclosurewith an associated non-volatile memory portion (but without the volatileRAM or DRAM) works according to an eXecution-in-Place (XiP) method thatretrieves the data from the memory.

Generally speaking, eXecution-in-Place means a method of executingprograms directly from a non-volatile memory portion rather than copyingit into a volatile memory. It is an extension of using shared memory toreduce the total amount of memory required.

The main effect of the XiP method is that the program text consumes nowritable memory, saving such a memory for dynamic data, and that allinstances of the program are run from a single copy and executingunconditional jumps directly from the non-volatile memory.

The presence of the unconditional jumps justifies the low initiallatency time needed the initial latency is the main root cause of lossof performance in this type of configuration since the size of thedouble word needed between jumps, i.e. from five to eight double words.

However, the non-volatile memory portion 210 must provide a similarinterface to the CPU as a volatile memory and the interface must providesufficiently fast read operations with a random access pattern;moreover, if there is a file system, it needs to expose appropriatemapping functions and the executed program must be linked to be aware ofthe appropriate address of the memory portion.

The storage requirements are usually met by using a NOR flash memoryportion, which can be addressed as individual words for read operations,although it is a bit slower than normal RAM memories in most setups.

Typically, in SoC including a RAM portion, the first stage boot loaderis an XiP program that is linked to run at the address at which theflash chip(s) are mapped at power-up and contains a minimal program toset up the system RAM (which depends on the components used on theindividual boards and cannot be generalized enough so that the propersequence could be embedded into the processor hardware) and then loadsthe second stage bootloader or the OS kernel into the RAM.

During this initialization, writable memory may not be available, so allcomputations have to be performed within the processor registers. Forthis reason, first stage boot loaders tend to be written in assemblerlanguage and only do the minimum to provide a normal executionenvironment for the next program. Some processors either embed a smallamount of SRAM in the chip itself or allow using the onboard cachememory as RAM, to make this first stage boot loader easier to writeusing high-level language.

Well, thanks to the memory architecture of the present disclosure it ispossible to pass from a parallel mode for retrieving data and addressesfrom the memory sub arrays to a serial mode for checking theinterconnections.

The transition from the parallel to the serial mode is managed by theJTAG interface 300. However, the implementation of these dual modeoperations is allowed by the specific structure of a modified JTAG cell480 disclosed hereinafter.

Making refence to the schematic example of FIG. 5 it is shown a JTAGcell 500 modified according to the present disclosure. This cell 500corresponds to the schematic cell 480 of FIG. 4 .

The JTAG cell 500 has a first parallel input PIN terminal and a firstserial input SIN terminal receiving corresponding signals Pin and Sin.Moreover, the JTAG cell 500 has a first parallel output terminal POUTand a first serial output terminal SOUT. The scan-chain 430 allowsoutputting the whole 256 bits, because the first group is read directlyfrom the output while the second group is prepared in the back.

As shown in FIG. 5 the JTAG cell 500 may be considered a box with twoinput terminals PIN and SIN and two output terminals POUT and SOUT. Theinput terminal PIN is a parallel input while the input terminal SIN is aserial input. Similarly, the output terminal POUT is a parallel outputwhile the output terminal SOUT is a serial output.

Thanks to the serial input and output a testing process may be performedto check that no fault connection is present between the memorycomponent 210 and the associated SoC structure 200. Thanks to theparallel input and output the same JTAG cell is used as data buffer forthe completing the reading phase through the sense amplifiers SA.

The JTAG cell 500 comprises a boundary scan basic cell 580 including acouple of latches 501 and 502 and a couple of multiplexer 551 and 552. Afirst input multiplexer 551 and a second output multiplexer 552.

The boundary scan basic cell 580 is indicated by the dotted line box inFIG. 5 and is a two inputs cell, with a serial input corresponding toSIN and parallel input corresponding to PIN, and two outputs cell with aserial output corresponding to SOUT and a parallel output correspondingto POUT.

The first multiplexer 551 receives on a first input “0” a parallel inputsignal Pin from the first parallel input terminal PIN and on a secondinput “1” a serial input signal Sin from the first serial input terminalSIN.

This first multiplexer 551 is driven by a control signal ShiftDR and hasan output MO1. The cell 500 has two parallel outputs, i.e. MO1 and MO2.When the JTAG clock arrives, the serial output is driven out from theSOUT. SOUT is connected to the JTAG latch close to the multiplexer thatreceives a selector signal: Mode Controller (serial/parallel).Basically, the output of the latch connected to the input ‘1’ of thismultiplexer MO2 is also the SOUT.

The first multiplexer output MO1 is connected to a first input of thefirst latch 501 that receives on a second input terminal a clock signalClockDR.

The first latch 501 is connected in chain to the second latch 502 with afirst output of the first latch 501 connected to a first input of thesecond latch 502.

It is important to note that the output of the first latch 501 is alsothe serial output SOUT of the whole JTAG cell 500.

A second input terminal of the second latch 502 received a signalUpdateDR.

The second latch 502 has an output connected to an input of the secondmultiplexer 552, in particular to its second input.

This second multiplexer 552 is controlled by a Mode Control signal thatallows to switch the whole JTAG cell 500 from a serial to a parallelmode and viceversa.

In one embodiment of the present disclosure the JTAG cell 500 furtherincludes another couple of latches 521 and 522 provided between theparallel input Pin and the second multiplexer 552. These extra latches521 and 522 are the latching of the direct read, i.e. first group ofdata Bits, and the shadow one, i.e. second group of 128 data Bits. Inother words, the JTAG cell 500 includes the boundary scan cell 580 andat least the further latches 521 and 522.

We will refer hereinafter to these further latches as a third latch 521and a fourth latch 522. In other embodiments a longer chain of latchesmay be used.

More particularly, the third latch 521 and the fourth latch 522 areconnected in a small pipeline configuration with the third latch 521receiving on a first input the parallel input signal Pin from the firstparallel input terminal PIN and receiving on a second input a signalData_Load[0] corresponding to a first data load.

The fourth latch 522 receives on a first input the output of the thirdlatch 521 and receives on a second input a signal Data_Load[1]corresponding to a subsequent data load.

The output of the fourth latch 522 is connected to the first input “0”of the second multiplexer 552 that produces on its output terminal MO2the output signal for the parallel output terminal POUT.

If compared to a conventional JTAG cell the JTAG cell 500 of the presentdisclosure may be considered a modified JTAG cell because of thepresence of the two extra latches, the third and fourth latches 521 and522, beside the presence of the boundary scan cell 580.

Now, since this JTAG cell 500 is coupled to the output of each senseamplifier SA of the memory sub-array 420 it may be considered a databuffer including a data page, including in this example at leastone-hundred-and-twenty-eight (128) Bits for the reading of a combinedmemory page at a time from the four sub arrays 420.

However, as previously reported, the communication channel between thememory component and the SoC structure may need up to 256 Bits at a time(i.e. two combined memory words) and the JTAG cell 500 has been modifiedjust to duplicate the internal latches to be able to shift the first orhigher portion of the 128 Bits of the data to be read with the second orlower portion of the data to be read. Obviously, in this contest“higher” means the data portion that is loaded before while “lower”means the data portion that is loaded after.

A skilled in this art will understand that the number of internallatches of the modified JTAG cell 500 can be augmented in case of needto improve the number of Bits to be transferred to the SoC structurethrough the communication channel. For example, the above structure maybe expanded accordingly to the size of the page required by theparticular implementation of the memory controller.

Just to explain the manner in which data are transferred in the databuffer we have to imagine that when a data is loaded in the one of thetwo latches 521 or 522, the other latch is in a stand-by state but readyto receive the subsequent data portion.

Therefore, the first section including 128 Bit is transferred to the SoCstructure for a first data elaboration while the reading phase is notstopped since the other portion of 128 Bits are prepared to be loadedinto the latches at the subsequent clock signal.

In this example, each data buffers contains 128 modified JTAG cells 500and the common Data_Load[1:0] are signals generated to allow to capturethe whole 256 Bits, that is to say: eight double words DWs according tothe proposed implementation (four sub arrays for each double word).

The signal generation is internally controlled when the read operationis performed in a specific data buffer and the signals are controlled bythe SoC structure to allow performing read phase using a 128 Bitsparallelism.

The main benefit of this memory architecture is that each buffer cancontain the whole double words DWs thus leaving free the sense amplifierto read in another memory location.

The presence of the modified JTAG cell 500 is particular important asoutput of the sense amplifiers since allows:

-   -   a. Using the boundary scan as method to check the        interconnection between the SoC 10 and the Flash Array component        1;    -   b. Implement the Direct Memory Access connecting directly the        sense amplifier with the controller;    -   c. It allows to leave the sense amplifier to prepare the second        256 bit wide page plus the address plus the ECC and written        close to the page.

Another advantage is given by the possibility to adopt a boundary-scantest architecture including modified JTAG cells 500 thus obtaining a newand peculiar boundary-scan test architecture like the one shown in theschematic view of FIG. 5 . This is a further advantage since for thistest only one output driven is needed and this is obtained using thesignal TCK and the data stored in the cells. The scan chain testrequires the SoC 10 to test the output of the scan chain.

A skilled in this art will understand that the number of internallatches of the modified JTAG cell can be augmented in case of need toimprove the number of Bits to be transferred to the SoC structurethrough the communication channel. For example, the above structure maybe expanded according to size of the memory device.

Just to explain the manner in which data are transferred in the databuffer we have to imagine that when a data is loaded in the one of thetwo latches 221 or 222, the other latch is in a stand-by state but readyto receive the subsequent data portion.

Therefore, the first section including 128 Bit is transferred to the SoCstructure for a first data elaboration while the reading phase is notstopped since the other portion of 128 Bits are prepared to be loadedinto the latches at the subsequent clock signal.

Each data buffers contains 128 modified JTAG cells 500 and the commonData_Load[1:0] are signals generated to allow to capture the whole 256Bits, that is to say: eight double words DWs according to the proposedimplementation.

The signal generation is internally controlled when the read operationis performed in a specific data buffer and the signals are controlled bythe SoC structure to allow performing read phase using a 128 Bitsparallelism.

The main benefit of this memory architecture is that each buffer cancontain the whole double words DWs thus leaving free the sense amplifierto read in another memory location.

The IEEE1532 standard enables the In-System Programming using theIEEE1149 as main interface protocol. The need of having a very lowinitial latency and high throughput is driving the generation of thefollowing scheme for the addressing per sub-array 420. The point is thatwe are not interested in the program data load time and we can use aserial interface using standard IEEE 1149 and 1532. The low latency isdriven by the proper size of the block and the optimization in the datapath. The data path is, usually, the internal gates that are connectingthe array to the output pads

Let's now see the Array Addressing Scheme in JTAG making reference tothe examples of FIGS. 7 and 8 .

Making first reference to FIG. 7 , it is illustrated a sub-arrayaddressing scheme which involve a set of instructions implemented in twoways which are: global address loading and local address loading.

The need of having a very low initial latency and high throughput isdriving the generation of the following scheme for the addressing persub-array. FIG. 6 shows row address buffers and the corresponding rowdata buffers in the structure similar to DRAM but here we have adoptedthe super-pages addresses and corresponding data, i.e. 168×2.

The implemented set of instructions to address the memory arrayimplemented can be of two types or two levels of address; in otherwords: a global instruction selects the sub array while a localinstruction selects one of the address register (for instance one of thefour) associated with the selected subarray.

Global address loading: in this case all the sub array will receive theaddress in multiple steps using a command, i.e. load_global_address_0,load_global_address_1, etc.

Local address loading: in this case only the addressed register in theselected sub-array will receive the new address, i.e. local_address_0_0,local_address_0_1, local_global_address_1_3, etc.

Each sub-array will contain a set of 4x data registers, for instance4×(data+address+ECC registers) corresponding each to an addressregister. 4× data registers are containing a super-page, that is to say:data_H+data_L (having removed the link to the specific address).

The address registers are connected to the address decoder when the reador modify operation are addressing the array. The link is driven by theflash controller in the modify phase while the read finite state machineis linking them when the read is triggered. The address register isloaded using a JTAG finite state machine. when the correspondinginstruction, Load_Address is recognized and the Shift_DR state is in theJTAG tap then the TDI is connected to the address register.

A Global_Address_Loadx command is used to load at the same time thenibble of eight bits in the corresponding registers:

Global_Address_Load0 in the instruction register generates the load ofthe addr0_0. This command, for example, can address the sub array 0;similarly, it happens for the selection of the corresponding sub arrayaddress registers, addr1_0, addr2_0 and addr3_0 using three TCK cycleswhen the finite state machine of the JTAG interface is in the Shift_DRstate.

Local_Address_Load0_0 in the instruction register generates the load ofthe addr0_0, using three TCK cycles when the finite state machine is inthe Shift_DR state. This command, as example, addresses the register 0of the selected subarray. This means that when the ShiftDR is reachedthe TDI is connected to the input of this shift register and the TDO tothe output, if the flexible TDI is used we need only three clock periodsTck to have the whole address inside the selected address register,otherwise we would need 24 clock periods Tck.

These instructions (Global_Address_Load0, Global_Address_Load1,Global_Address_Load2, Global_Address_Load3) allow the pre-load of theaddress for all the channels implemented in the flash array. Those fourinstructions are implemented to select one of the four sub array. In apossible implementation with eight cores, we will need eight commands,one for each core or a method to select one of the cores using onecommand and a sub array address. Therefore, the introduction of theabove command permits to optimize the communication between the SoCstructure 10 and the memory component 1 enhancing the transferperformance to the controller

The instructions (Local_Address_Load0_0, . . . , Local_Address3_3) allowthe use of a single core/channel avoiding the need for the controller tomanage the whole set of cores when only one is working; the cores areindipendent and they can use their own channel when it is needed. Theseinstructions serves for selecting one of the address register of theselected subarray.

The implementation of this last disclosed mechanisms ensures theoptimization of the read operation of the memory.

Making now reference to the example of FIG. 8 , if the SoC structure 200needs up to 168×2 Bits at a time, the data buffers will be duplicated soto be able to shift, assuming to use the address 0 of the sub array 0:

-   First pass of the first group of Bits: Data 0_0_H [127:0]+ADD+ECC-   Second pass of the second group of Bits: Data 0_0_L [127:0]+ADD+ECC

The address buffers are made using JTAG Cells.

According to the standard IEEE 1149 and 1532 concerning the JTAG, theprotocol IEEE1532 is used as expanded command set to operate in each subarray and the new sub-array structure enables the In-System Programming.

From the foregoing, it will be appreciated that specific embodiments ofthe invention have been described herein for purposes of illustration,but that various modifications may be made without deviating from thescope of the invention. Accordingly, the invention is not limited exceptas by the appended claims.

1.-20. (canceled)
 21. An apparatus, comprising: a plurality of subarrays of memory cells; sense amplifiers coupled to a corresponding subarray of the plurality of sub arrays; and a data buffer comprising aplurality of JTAG cells coupled to outputs of the sense amplifiers,wherein each JTAG cell of the plurality of JTAG cells includes: aparallel input (PIN) terminal and a serial input (SIN) terminal; and aparallel output terminal (POUT) and a serial output terminal (SOUT); andwherein the plurality of JTAG cells form a scan-chain, and wherein: thePIN terminal of a first JTAG cell is coupled to an output of a firstsense amplifier; the POUT terminal of the first JTAG cell is coupled toa corresponding data input/output terminal; the SIN terminal of thefirst JTAG cell is coupled to the SOUT terminal of a second JTAG cell;and the SOUT terminal of the first JTAG cell is coupled to the SINterminal of a third JTAG cell.
 22. The apparatus of claim 21, whereinthe corresponding data input/output terminal is a terminal of aSystem-on-Chip (SoC).
 23. The apparatus of claim 21, wherein theapparatus is a memory device, and wherein the scan-chain forms a singleshift register for testing an interconnection between pads of the memorydevice and corresponding pads of the SoC.
 24. The apparatus of claim 21,wherein the memory device is a non-volatile memory device.
 25. Theapparatus of claim 21, wherein the first JTAG cell comprises at leastfour latches.
 26. The apparatus of claim 25, wherein the first JTAG cellcomprises at least two multiplexers.
 27. The apparatus of claim 21,wherein the first JTAG cell comprises: an input multiplexer; a firstpair of latches; an output multiplexer between the first pair oflatches; and a second pair of latches.
 28. The apparatus of claim 21,wherein the apparatus comprises a memory component structurallyindependent from a System-on-Chip (SoC) to which it is coupled.
 29. Theapparatus of claim 28, wherein the memory component partially overlapsthe SoC.
 30. The apparatus of claim 28, wherein the memory component iscoupled to the SoC in a face-to-face manner.
 31. An apparatus,comprising: a plurality of sub arrays of memory cells; sense amplifierscoupled to a corresponding sub array of the plurality of sub arrays; anda plurality of scan-chain cells forming a scan-chain, wherein theplurality of scan-chain cells are coupled to outputs of the senseamplifiers, and wherein each scan-chain cell of the plurality ofscan-chain cells includes: a parallel input (PIN) terminal and a serialinput (SIN) terminal; and a parallel output terminal (POUT) and a serialoutput terminal (SOUT); and wherein: the PIN terminal of a firstscan-chain cell is coupled to an output of a first sense amplifier; thePOUT terminal of the first scan-chain cell is coupled to a correspondingdata input/output terminal; the SIN terminal of the first scan-chaincell is coupled to the SOUT terminal of a second scan-chain cell; andthe SOUT terminal of the first scan-chain cell is coupled to the SINterminal of a third scan-chain cell.
 32. The apparatus of claim 31,wherein each scan-chain cell of the plurality of scan-chain cellscomprises: a JTAG cell; and a first additional latch.
 33. The apparatusof claim 32, wherein each scan-chain cell of the plurality of scan-chaincells further comprises a second additional latch.
 34. The apparatus ofclaim 32, wherein the PIN terminal of the first scan-chain cell iscoupled to the first additional latch of the first scan-chain cell andto a first multiplexer of the first scan-chain cell.
 35. The apparatusof claim 31, wherein the first scan-chain cell comprises a JTAG cell, afirst additional latch, and a second additional latch, and wherein anoutput of the first additional latch is provided to an input of thesecond additional latch.
 36. The apparatus of claim 35, wherein the PINterminal of the first scan-chain cell is coupled to the first additionallatch and to a first multiplexer of the first scan-chain cell.
 37. Theapparatus of claim 36, wherein an output of the second additional latchis provided to an input of a second multiplexer of the first scan-chaincell.
 38. An apparatus, comprising: a plurality of sub arrays of memorycells; sense amplifiers coupled to a corresponding sub array of theplurality of sub arrays; and a plurality of scan-chain cells forming ascan-chain, wherein the plurality of scan-chain cells are coupled tooutputs of the sense amplifiers, and wherein each scan-chain cell of theplurality of scan-chain cells includes: a parallel input (PIN) terminalcoupled to a first latch and to a first multiplexer; a serial input(SIN) terminal coupled to the first multiplexer; a second latch coupledto an output of the multiplexer; a serial output terminal (SOUT) coupledto an output of the second latch, wherein the output of the second latchis provided to a third latch; and a parallel output terminal (POUT)coupled to an output of a second multiplexer, wherein the secondmultiplexer receives, as inputs, an output from the third latch and anoutput from a fourth latch.
 39. The apparatus of claim 38, wherein aninput of the fourth latch is coupled to an output of the first latch.40. The apparatus of claim 38, wherein each scan-chain cell of theplurality of scan-chain cells comprises a JTAG cell.